The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Aug. 05, 2014
Applicant:

Soitec, Bernin, FR;

Inventors:

Yann Sinquin, Grenoble, FR;

Jean-Marc Bethoux, La Buisse, FR;

Oleg Kononchuk, Theys, FR;

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/268 (2006.01); H01L 31/0687 (2012.01); H01L 21/78 (2006.01); H01L 29/20 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/268 (2013.01); H01L 21/7806 (2013.01); H01L 29/20 (2013.01); H01L 29/2003 (2013.01); H01L 31/06875 (2013.01); H01L 33/0079 (2013.01);
Abstract

A method for separating a structure from a substrate through electromagnetic irradiations (EI) belonging to a spectral range comprises the steps of a) providing the substrate, b) forming an absorbent separation layer on the substrate, c) forming the structure to be separated on the separation layer, d) exposing the separation layer to the electromagnetic irradiations (EI) via the substrate such that the separation layer breaks down under the effect of the heat stemming from the absorption, the method being notable in that it comprises a step b1) of forming a transparent thermal barrier layer on the separation layer, the exposure period and the thickness of the thermal barrier layer being adapted such that the temperature of the structure to be separated remains below a threshold during the exposure period, beyond which threshold, faults are likely to appear in the structure.


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