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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9679770 B1

PDFFull Text
Date of Patent:
Jun. 13, 2017

Filed:

Feb. 11, 2015

Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Hidetami Yaegashi, Tokyo, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Thomas Pham

Int. Cl.
CPC ...
C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); B44C 1/22 (2006.01); H01L 21/033 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/67178 (2013.01);
Abstract

A semiconductor device manufacturing method of the present invention includes forming a base film having a water-repellent surface on a substrate; forming a photosensitive film having a water-repellent surface on the base film; developing the photosensitive film to expose the base film, thereby forming a photosensitive film pattern; supplying a first spacer material on the photosensitive film and on the exposed base film; and removing at least a part of the first spacer material formed on a top surface of the photosensitive film and a top surface of the base film.

Find Patent Forward Citations

Yaegashi, Hidetami. (2017). Semiconductor device manufacturing method and semiconductor device manufacturing apparatus (U.S. Patent No. 9679770). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9679770

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