The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Dec. 15, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yoshihiro Kawaguchi, Koshi, JP;

Satoshi Kaneko, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/10 (2006.01); B05C 3/02 (2006.01); B05C 3/00 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
B05C 11/1002 (2013.01); B05C 3/005 (2013.01); B05C 3/02 (2013.01); C23C 18/168 (2013.01); C23C 18/1619 (2013.01); C23C 18/1632 (2013.01); C23C 18/1675 (2013.01); C23C 18/1669 (2013.01); Y10T 137/0318 (2015.04); Y10T 137/0329 (2015.04);
Abstract

A substrate processing apparatus includes one or more substrate processing unitstoeach processing a substratewith a processing fluid; processing fluid supply unitsandsupplying the heated processing fluid to the substrate processing unitstoand a controllercontrolling the processing fluid supply unitsand. The processing fluid supply unitsandinclude a storage tankstoring the processing fluid; a heating heat exchangerheating the processing fluid; and a supply pathsupplying the processing fluid to the substrate processing unitsto. The supply pathincludes a bypass pathbypassing the heating heat exchangerat an upstream of the substrate processing unitsto. The processing fluid heated by the heating heat exchangerand the processing fluid supplied from the bypass pathare mixed to be supplied.


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