The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Jun. 28, 2013
Applicant:

Maxim Integrated Products, Inc., San Jose, CA (US);

Inventors:

Christopher S. Blair, Lake Oswego, OR (US);

Albert Bergemont, Palo Alto, CA (US);

Sudarsan Uppili, Portland, OR (US);

Fanling H. Yang, Beaverton, OR (US);

Guillaume Bouche, Beaverton, OR (US);

Assignee:

Maxim Integrated Products, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/80 (2006.01); H01L 23/48 (2006.01); H01L 29/78 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7809 (2013.01); H01L 21/50 (2013.01); H01L 29/7801 (2013.01); H01L 29/7802 (2013.01); H01L 29/7835 (2013.01);
Abstract

A semiconductor device including a VDMOS device formed therein includes a terminal, or contact, to the drain region of the VDMOS device from the frontside of the device. In one or more implementations, a semiconductor device includes a semiconductor substrate having a first surface and a second surface and a vertical diffused metal-oxide-semiconductor device formed within the semiconductor substrate. The vertical diffused metal-oxide-semiconductor device includes at least one source region formed proximate to the first surface and at least one drain region formed proximate to the second surface. A through-substrate via is formed within the semiconductor substrate, and the through-substrate via electrically connected to the drain region. The through-substrate via provides an electrical interconnection to the drain region from the first surface.


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