The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Dec. 16, 2015
Powertech Technology Inc., Hsinchu County, TW;
Chia-Hsiang Yuan, Hsinchu County, TW;
Chia-Wei Chang, Hsinchu County, TW;
Kuo-Ting Lin, Hsinchu County, TW;
Yong-Cheng Chuang, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
Provided is a package structure including a substrate, N dies, N first pads, N vertical wires, and a second pad. The N dies are stacked alternatively on the substrate, so as to form a multi-die stack structure. The N dies include, from bottom to top, first to Ndies, wherein N is an integer greater than 1. The first die is a bottom die, and the Ndie is a top die. The first pads are disposed on an active surface of the dies respectively. The vertical wires are disposed on the first pads respectively. The second pad is disposed on the top die.