The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Aug. 01, 2016
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Inventors:
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/3675 (2013.01); H05K 7/20927 (2013.01); H01L 23/3672 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45655 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01);
Abstract
A coolerof a semiconductor device includes an inlet portionand an outlet portionfor a cooling liquid, an inlet path, an outlet path, and a cooling flow path. The inlet pathand the outlet pathhave asymmetrical planar shapes. A connection portionbetween the inlet pathand the inlet portionis opposed to the cooling flow pathof a part immediately below plural circuit substratesarranged on the cooler. A connection portionbetween the outlet pathand the outlet portionis opposed to the cooling flow pathof a part immediately below plural circuit substratesarranged on the cooler