The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Aug. 29, 2015
Applicant:

Amkor Technology, Inc., Tempe, AZ (US);

Inventors:

Hyeong Il Jeon, Gyeonggi-do, KR;

Hyung Kook Chung, Seoul, KR;

Hong Bae Kim, Seoul, KR;

Byong Jin Kim, Gyeonggi-do, KR;

Assignee:

Amkor Technology, Inc., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/97 (2013.01);
Abstract

In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.


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