The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Jan. 04, 2016
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
No Il Park, Suwon-si, KR;
Seung Wook Park, Suwon-si, KR;
Eung Suek Lee, Suwon-si, KR;
Tae Sung Jeong, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part.