The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Jul. 13, 2015
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Ofir Greenberg, Haniel, IL;

Yuval Gronau, Ramat Hasharon, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/88 (2006.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
H01J 37/222 (2013.01); H01J 37/28 (2013.01); H01J 2237/2813 (2013.01);
Abstract

A system for reviewing a wafer, the system may include a memory unit that is configured to store information about locations of a set of suspected defects that are located at multiple dice of the wafer; electron optics that is configured to obtain images of reference elements, wherein the reference elements are located within a first reference die of the wafer; and a processor that is configured to: compare the first sub-set of suspected defects to a first sub-set of reference elements to provide a first evaluation result; and select, in response to the first evaluation result, a source of a second sub-set of reference elements. The electron optics is further configured to obtain images of a second sub-set of reference elements that are located within a second reference die of the wafer when it is determined that the second reference die is the source of the second sub-set of reference elements. The processor is further configured to compare the second sub-set of suspected defects to the second sub-set of reference elements to provide a second evaluation result.


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