The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Mar. 22, 2012
Kazuyuki Tamura, Tokyo, JP;
Takashi Akutsu, Tokyo, JP;
Yuki Eto, Tokyo, JP;
Tomohide Hukuzaki, Osaka, JP;
Kazuyuki Tamura, Tokyo, JP;
Takashi Akutsu, Tokyo, JP;
Yuki Eto, Tokyo, JP;
Tomohide Hukuzaki, Osaka, JP;
LINTEC Corporation, Tokyo, JP;
Arakawa Chemical Industries, LTD., Osaka, JP;
Abstract
The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.