The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Apr. 25, 2014
Ibiden Co., Ltd., Ogaki, JP;
Kazuki Kajihara, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate, and a through-hole conductor formed in the hole such that the conductor is connecting the first and second conductive layers. The conductor has a seed layer on inner wall of the hole, a laminated plated layer on the seed layer and a filled plated layer on the laminated layer, the laminated layer is formed such that the laminated layer is closing center portion of the hole and forming recess at end of the hole, the filled layer is formed such that the filled layer is filling the recess, and the laminated layer includes multiple electrolytic plated films laminated along the seed layer and each having thickness which is less at edge than at center.