The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Feb. 25, 2016
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Thomas Taake de Boer, Hummelstown, PA (US);

Michael John Phillips, Camp Hill, PA (US);

John Joseph Consoli, Harrisburg, PA (US);

Sandeep Patel, Middletown, PA (US);

Bruce Allen Champion, Camp Hill, PA (US);

Linda Ellen Shields, Camp Hill, PA (US);

Assignee:

TE CONNECTIVITY CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/648 (2006.01); H01R 13/6599 (2011.01); H01R 13/6596 (2011.01); H01R 13/6587 (2011.01); H01R 13/6585 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6599 (2013.01); H01R 13/6596 (2013.01); H01R 13/6585 (2013.01); H01R 13/6587 (2013.01);
Abstract

A ground contact module includes a ground leadframe having a ground contact with a transition portion extending between mating and terminating ends. A ground dielectric body holds the ground leadframe. The ground dielectric body has a low loss layer overmolded over the ground leadframe. The ground dielectric body has a lossy band separate and discrete from the low loss layer and attached thereto in proximity to the ground contact such that the lossy band is electrically coupled to the ground contact. The lossy band is manufactured from lossy material having conductive particles in a dielectric binder material and absorbs electrical resonance propagating through the contact module stack.


Find Patent Forward Citations

Loading…