The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Dec. 12, 2008
Applicants:
Tse Nga NG, Palo Alto, CA (US);
Ana Claudia Arias, Los Gatos, CA (US);
Jurgen H. Daniel, San Francisco, CA (US);
Inventors:
Tse Nga Ng, Palo Alto, CA (US);
Ana Claudia Arias, Los Gatos, CA (US);
Jurgen H. Daniel, San Francisco, CA (US);
Assignee:
PALO ALTO RESEARCH CENTER INCORPORATED, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/05 (2006.01); H01L 51/00 (2006.01); H05K 3/12 (2006.01); H05K 3/38 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 51/052 (2013.01); H01L 51/0005 (2013.01); H01L 51/0022 (2013.01); H05K 3/125 (2013.01); H05K 3/1208 (2013.01); H01L 27/1292 (2013.01); H01L 51/0036 (2013.01); H01L 51/0043 (2013.01); H01L 51/0545 (2013.01); H05K 3/381 (2013.01); H05K 2203/013 (2013.01); H05K 2203/087 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1173 (2013.01);
Abstract
An embodiment is a method and apparatus to treat surface of polymer for printing. Surface of a polymer having a surface energy modified for a time period to control a feature characteristic and/or provide a hysteresis behavior. A material is printed on the surface to form a circuit pattern having at least one of the controlled feature characteristic and the hysteresis behavior.