The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Mar. 10, 2014
Applicant:

Renesas Electronics Corporation, Kawasaki-shi, JP;

Inventors:

Yasutaka Nakashiba, Kawasaki, JP;

Kenta Ogawa, Kawasaki, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); G11C 5/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H01L 23/48 (2006.01); H01L 27/06 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); G11C 5/005 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49855 (2013.01); H01L 23/5227 (2013.01); H01L 23/562 (2013.01); H01L 24/97 (2013.01); H05K 3/0052 (2013.01); H01L 23/48 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 27/0688 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15183 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H05K 1/117 (2013.01); H05K 3/284 (2013.01); H05K 2201/0949 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1572 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/4913 (2015.01);
Abstract

An external storage device including an interconnect substrate having a contact type external terminal, at least one semiconductor chip disposed over a first surface of the interconnect substrate, and a sealing resin layer which seals the at least one semiconductor chip and does not cover the external terminal. The at least one semiconductor chip includes a storage device, an inductor being connected to the storage device, a driver circuit configured to control the inductor and an interconnect layer. The interconnect layer is formed at a first surface of the semiconductor chip and includes the inductor. The first surface of the semiconductor chip is other than facing the first surface of the interconnect substrate, and the inductor and the driver circuit are connected to each other through the interconnect layer.


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