The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Sep. 29, 2014
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Liang Yan, St. Joris Weert, BE;
Roel Daamen, Herkenbosch, NL;
Anco Heringa, Waalre, NL;
Erwin Hijzen, Leuven, NL;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 27/12 (2006.01); H01L 23/367 (2006.01); H01L 27/02 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1203 (2013.01); H01L 23/3677 (2013.01); H01L 27/0211 (2013.01); H01L 29/0696 (2013.01); H01L 29/7824 (2013.01); H05K 7/20 (2013.01); H01L 29/0653 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An integrated heat sink array is introduced in SOI power devices having multiple unit cells, which can be used to reduce the temperature rise in obtaining more uniform temperature peaks for all the unit cells across the device area, so that the hot spot which is prone to breakdown can be avoided, thus the safe operating area of the device can be improved. Also the array sacrifice less area of the device, therefore results in low Rdson.