The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Jan. 15, 2015
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Tzu-Ming Huang, New Taipei, TW;
Shen-Ping Wang, Keelung, TW;
Lieh-Chuan Chen, Hsinchu, TW;
Po-Tao Chu, New Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A semiconductor package having a lead frame over which a first device and a second device are spaced is provided. The lead frame includes a die pad upon which a first chip and a second chip are spaced and bonded. The first chip includes the first device, which has a first operating voltage. The second chip includes the second device, which has a second operating voltage greater than the first operating voltage. A dielectric layer is arranged between the die pad and the second device. A method for manufacturing the semiconductor package is also provided.