The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Dec. 27, 2013
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masayuki Nakanishi, Tokyo, JP;

Kenji Kodera, Tokyo, JP;

Nobuhiro Yanaka, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B24B 9/06 (2006.01); B24B 57/02 (2006.01); B24B 37/02 (2012.01); B24B 9/08 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); B24B 9/065 (2013.01); B24B 9/08 (2013.01); B24B 37/02 (2013.01); B24B 57/02 (2013.01); H01L 21/02057 (2013.01); H01L 21/02087 (2013.01);
Abstract

A polishing apparatusincludes a holding stagethat holds a central portion of a back surface of a substrate W, a motor Mthat rotates the holding stage, a front surface nozzlethat feeds a rinse liquid to a front surface of the substrate W, a back surface nozzlethat feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control sectionthat feeds the rinse liquid through the back surface nozzleafter a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzleand a polishing head assemblyA that polishes a peripheral portion of the substrate installed on the holding stageafter the rinse liquid control sectionfeeds the rinse liquid to the substrate W.


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