The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Mar. 09, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jaehee Kim, Yongin-si, KR;

Dae-Yong Kang, Suwon-si, KR;

SoonMok Ha, Hwaseong-si, KR;

Joonsoo Park, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/033 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0338 (2013.01); H01L 21/0332 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01);
Abstract

A method for forming fine patterns includes patterning a hard mask layer on an etch target layer to form sacrificial pillars and a first opening disposed between the sacrificial pillars and exposing the etch target layer, forming a block copolymer layer on the etch target layer exposed through the first opening, phase-separating the block copolymer layer to form first block patterns spaced apart from the sacrificial pillars and a second block pattern, forming first holes by etching the etch target layer exposed by removing the first block patterns, and forming second holes in the etch target layer exposed by removing the sacrificial pillars, the second holes being different from the first holes.


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