The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Jan. 12, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Bruce L. Fleming, Morgan Hill, CA (US);

Achmed R. Zahir, Menlo Park, CA (US);

Arvind Mandhani, San Francisco, CA (US);

Satish B. Acharya, Bangalore, IN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/36 (2006.01); G06F 13/40 (2006.01); G06F 13/20 (2006.01); G06F 13/42 (2006.01); G06F 13/38 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4027 (2013.01); G06F 13/20 (2013.01); G06F 13/385 (2013.01); G06F 13/404 (2013.01); G06F 13/42 (2013.01); G06F 13/4221 (2013.01);
Abstract

An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modern PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.


Find Patent Forward Citations

Loading…