The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Nov. 26, 2013
Applicant:
Adeka Corporation, Tokyo, JP;
Inventors:
Tomoharu Yoshino, Tokyo, JP;
Atsushi Sakurai, Tokyo, JP;
Tsubasa Shiratori, Tokyo, JP;
Masako Hatase, Tokyo, JP;
Hiroyuki Uchiuzou, Tokyo, JP;
Akihiro Nishida, Tokyo, JP;
Assignee:
ADEKA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 5/06 (2006.01); C23C 16/40 (2006.01); C23C 16/06 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
C07F 5/069 (2013.01); C23C 16/06 (2013.01); C23C 16/403 (2013.01); C23C 16/44 (2013.01);
Abstract
Disclosed is an aluminum compound of general formula (I) and a thin film forming material containing the aluminum compound. In formula (I), Rand Reach represent straight or branched C2-C5 alkyl, and Rrepresent methyl or ethyl. Rand Rare each preferably ethyl. The compound has a low melting temperature, sufficient volatility, and high thermal stability and is therefore suited for use as a material for thin film formation by CVD.