The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Nov. 05, 2014
Ibiden Co., Ltd., Ogaki, JP;
Naoki Katsuda, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A printed wiring board includes a core substrate including a resin insulating layer and multiple conductor layers, a first wiring structure formed on a first surface of the core substrate and including a conductor layer and a resin insulating layer, and a second wiring structure formed on a second surface of the core substrate and including a conductor layer and a resin insulating layer. The core substrate is interposed between the first wiring structure and the second wiring structure such that the resin insulating layers and conductor layers in the core substrate, first wiring structure and second wiring structure are alternately laminated, the resin insulating layer in the first wiring structure has a vol % of resin which is larger than a vol % of resin in the resin insulating layer in the second wiring structure such that a difference in the vol % of resin in the first and second wiring structures is in the range of from 0.5% to 5.0%.