The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Mar. 03, 2016
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Inventors:
Assignee:
Shinko Electric Industries Co., LTD., Nagano-Ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15333 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor device includes a wiring substrate, a semiconductor element mounted on an upper surface of a wiring substrate, and a magnetic shield arranged above the upper surface of the wiring substrate to cover an upper side of the semiconductor element. The magnetic shield is formed from a soft magnetic material and includes inclined faces that are inclined straight with respect to the upper surface of the wiring substrate at a portion overlapped with the semiconductor element in a plan view.