The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Jul. 25, 2012
Applicants:

Oskar Neuhoff, Nittendorf, DE;

Tobias Gamon, Warstein, DE;

Norbert Martin Haueis, Lappersdorf, DE;

Dirk Pikorz, Warstein, DE;

Michael Wolfgang Larisch, Regensburg, DE;

Franz Reithner, Heimberg, DE;

Inventors:

Oskar Neuhoff, Nittendorf, DE;

Tobias Gamon, Warstein, DE;

Norbert Martin Haueis, Lappersdorf, DE;

Dirk Pikorz, Warstein, DE;

Michael Wolfgang Larisch, Regensburg, DE;

Franz Reithner, Heimberg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C23F 1/00 (2006.01); B65H 1/00 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67207 (2013.01); H01L 21/6715 (2013.01); H01L 21/6719 (2013.01); H01L 21/67126 (2013.01); H01L 21/67173 (2013.01); H01L 21/67253 (2013.01); H01L 21/67288 (2013.01); H01L 21/68707 (2013.01); H01L 21/68728 (2013.01); H01L 24/72 (2013.01); H01L 24/90 (2013.01); H01L 22/12 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/10253 (2013.01); Y10T 29/41 (2015.01); Y10T 29/53022 (2015.01); Y10T 29/53187 (2015.01);
Abstract

A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.


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