The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Dec. 13, 2012
Applicant:

Soitec, Crolles, FR;

Inventors:

Didier Landru, Champ des Froges, FR;

Carole David, Crolles, FR;

Ionut Radu, Crolles, FR;

Lucianna Capello, Grenoble, FR;

Yann Sinquin, Grenoble, FR;

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/428 (2006.01); H01L 21/268 (2006.01); H01L 21/02 (2006.01); H01L 21/20 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/268 (2013.01); H01L 21/02354 (2013.01); H01L 21/2007 (2013.01); H01L 21/324 (2013.01); H01L 21/428 (2013.01);
Abstract

The invention relates to a process for stabilizing a bonding interface, located within a structure for applications in the fields of electronics, optics and/or optoelectronics and that comprises an oxide layer buried between an active layer and a receiver substrate, the bonding interface having been obtained by molecular adhesion. In accordance with the invention, the process further comprises irradiating this structure with a light energy flux provided by a laser, so that the flux, directed toward the structure, is absorbed by the energy conversion layer and converted to heat in this layer, and in that this heat diffuses into the structure toward the bonding interface, so as to thus stabilize the bonding interface.


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