The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Jan. 26, 2015
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Ji Yeon Kim, Suwon-si, KR;
Kyoung Ku Kang, Suwon-si, KR;
Kyoung Soo Park, Suwon-si, KR;
Young Woo Park, Suwon-si, KR;
Byeong Geun Son, Suwon-si, KR;
Kyoung Hun Shin, Suwon-si, KR;
Young Ju Shin, Suwon-si, KR;
Kwang Jin Jung, Suwon-si, KR;
Jae Sun Han, Suwon-si, KR;
Ja Young Hwang, Suwon-si, KR;
Samsung SDI Co., Ltd., Yongin-Si, Gyeonggi-do, KR;
Abstract
A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80° C. to about 110° C. and a second epoxy resin having an exothermic peak temperature of 120° C. to 200° C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.