The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Jul. 07, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Kazunari Nakata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/265 (2013.01); H01L 21/324 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 29/66348 (2013.01); H01L 29/7397 (2013.01); H01L 2221/68327 (2013.01);
Abstract
On a first wafer surface of a semiconductor wafer, a projection-depression shape is formed. On the first wafer surface, a resin member is so formed to have a resin outer peripheral end positioned away from a wafer outer peripheral end and expose the wafer outer peripheral end. By partially removing the semiconductor wafer, on a second wafer surface of the semiconductor wafer, formed is a recessed shape having a recessed-portion outer peripheral end positioned 0.5 mm or more inside from the resin outer peripheral end. After performing a processing on the second wafer surface, the resin member is removed.