The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Dec. 21, 2015
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Jae Choon Kim, Incheon, KR;
Heejung Hwang, Suwon-si, Gyeonggi-do, KR;
Eon Soo Jang, Suwon-si, Gyeonggi-do, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A semiconductor package includes a semiconductor chip on a package substrate, a heat spreader on the semiconductor chip, a molding layer, an adhesive film between the semiconductor chip and the heat spreader, and a through-hole passing through the heat spreader. The heat spreader includes a first surface and a second surface. The molding layer covers sidewalls of the semiconductor chip and the heat spreader and exposes the first surface of the heat spreader. The adhesive film is on the second surface of the heat spreader.