The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Nov. 30, 2012
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Martin Standing, Villach, AT;
Andrew Roberts, Wrexham, GB;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/12 (2006.01); H05K 3/36 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/12 (2013.01); H01L 23/5389 (2013.01); H05K 3/368 (2013.01); H01L 23/5383 (2013.01); H01L 2924/0002 (2013.01); H05K 1/185 (2013.01); H05K 3/429 (2013.01); Y10T 29/49126 (2015.01);
Abstract
Embodiments relate to active devices embedded within printed circuit boards (PCBs). In embodiments, the active devices can comprise at least one die, such as a semiconductor die, and coupling elements for mechanically and electrically coupling the active device with one or more layers of the PCB in which the device is embedded. Embodiments thereby provide easy embedding of active devices in PCBs and inexpensive integration with existing PCB technologies and processes.