The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Feb. 04, 2016
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Jeanne P. Bickford, Essex Junction, VT (US);

John R. Goss, Saint Albans, VT (US);

Robert J. McMahon, Essex Junction, VT (US);

Troy J. Perry, Georgia, VT (US);

Thomas G. Sopchak, Williston, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01); G06F 17/50 (2006.01); G01R 31/317 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67271 (2013.01); G01R 31/31718 (2013.01); G06F 17/5045 (2013.01); H01L 22/14 (2013.01);
Abstract

Disclosed are methods for performing threshold voltage (VT)-type transistor sensitive and/or fan-out sensitive selective voltage binning (SVB) to improve SVB accuracy and, thereby product yield and reliability. In the methods, a process distribution for an integrated circuit chip design is divided into process windows, each associated with a corresponding performance range and a corresponding minimum supply voltage. First performance measurements are acquired from first performance monitors associated with first transistors on chips manufactured according to the design. Based on the first performance measurements, the chips are assigned to groups corresponding to the process windows. Second performance measurements are also be acquired from second performance monitors associated with second transistors, which are on the chips and which have either a different VT-type or a different maximum fan-out than the first transistors. Based on the second performance measurements, a determination is made as to whether chip group reassignment is warranted.


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