The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Jun. 23, 2014
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Martin Standing, Villach, AT;
Andrew Roberts, Wrexham, GB;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/186 (2013.01); H01L 24/97 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/82031 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H05K 1/184 (2013.01); H05K 2201/10166 (2013.01);
Abstract
Representative implementations of devices and techniques provide a semiconductor package comprising a laminate substrate. The laminate substrate includes at least one conductive layer laminated to a surface of an insulating core. The laminate substrate also includes one or more die openings, in which one or more semiconductor die are located.