The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

May. 23, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Eun Joo Choi, Daejeon, KR;

Jin Young Ryu, Daejeon, KR;

Woo Sung Kim, Daejeon, KR;

Houng Sik Yoo, Seoul, KR;

Han Na Lee, Daejeon, KR;

Hyeon Choi, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 33/00 (2006.01); C08L 33/12 (2006.01); C08J 3/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); C08F 283/12 (2006.01); C08L 101/02 (2006.01);
U.S. Cl.
CPC ...
C08L 33/12 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); C08F 283/12 (2013.01); C08J 3/126 (2013.01); C08L 101/02 (2013.01); C08J 2483/04 (2013.01); Y10T 428/2998 (2015.01); Y10T 428/31663 (2015.04);
Abstract

Provided are a resin blend including a first resin, and a second resin having a hydrophobic moiety represented by Formula 1 at a main chain and having a difference in surface energy from the first resin at 25° C. of 0.1 to 20 mN/m, and formed in a layer-separated structure, a pellet, a method of manufacturing the same, and a resin molded article having a specific layer-separated structure. Because of the resin blend, a molded product may have enhanced mechanical properties and surface hardness, and additional surface coating may be omitted, thereby reducing a processing time, increasing productivity, and reducing production costs.


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