The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Apr. 26, 2013
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Satoshi Kumazawa, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26D 9/00 (2006.01); B23K 26/42 (2006.01); B23K 26/36 (2014.01); B23K 26/00 (2014.01); B23K 26/364 (2014.01); B23K 26/60 (2014.01); B23K 26/40 (2014.01); H01L 33/00 (2010.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B26D 9/00 (2013.01); B23K 26/0093 (2013.01); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 26/60 (2015.10); B23K 2203/50 (2015.10); H01L 33/0095 (2013.01); Y10T 83/0215 (2015.04);
Abstract

A workpiece dividing method for dividing a platelike workpiece into a plurality of individual chips. The workpiece dividing method includes a workpiece preparing step of preparing the platelike workpiece, at least one side of the workpiece being formed as a mat surface, a holding step of holding the workpiece on a holding surface of a chuck table in the condition where the mat surface of the workpiece is exposed, a cut groove forming step of cutting the mat surface of the workpiece held on the holding surface of the chuck table by using a cutting blade to thereby form a cut groove with a remaining portion, and a laser cutting step of applying a laser beam to the workpiece along the cut groove to thereby cut the remaining portion.


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