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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9648757 B1

PDFFull Text
Date of Patent:
May. 09, 2017

Filed:

Oct. 22, 2014

Method for manufacturing space transformer by using carrier substrate made for chip package and provided with elongated contacts

Applicant:

Mpi Corporation, Chu-Pei, Hsinchu Shien, TW;

Inventors:

Chung-Tse Lee, Chu-Pei, TW;

Chien-Chou Wu, Chu-Pei, TW;

Tsung-Yi Chen, Chu-Pei, TW;

Assignee:

MPI CORPORATION, Chu-Pei, Hsinchu Shien, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H05K 3/40 (2006.01); G01R 3/00 (2006.01); H05K 3/14 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01); G01R 1/067 (2006.01); G01R 1/20 (2006.01); H01R 43/20 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); G01R 1/067 (2013.01); G01R 1/20 (2013.01); G01R 3/00 (2013.01); H01R 43/20 (2013.01); H05K 3/10 (2013.01); H05K 3/143 (2013.01); H05K 3/32 (2013.01); H05K 3/403 (2013.01); H05K 3/4038 (2013.01); G01R 1/07378 (2013.01); H05K 2201/09409 (2013.01); H05K 2203/0574 (2013.01); H05K 2203/1476 (2013.01); Y10T 29/49147 (2015.01); Y10T 29/49162 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.

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