The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
May. 18, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/26 (2014.01); H01L 23/00 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); G01R 31/2601 (2013.01); H01L 22/32 (2013.01); H01L 24/06 (2013.01); H01L 23/5256 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A method of manufacturing a semiconductor package includes providing a semiconductor chip including a circuit pattern, a connection pad, a first test pad and a second test pad, each of the connection pad, the first test pad and the second test pad respectively electrically connected to the circuit pattern, evaluating electrical characteristics of the semiconductor chip by applying a first test voltage to the first test pad and a second test voltage to the second test pad, the second test voltage being higher than the first test voltage, and electrically disconnecting the second test pad from the circuit pattern.