The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Feb. 05, 2015
Applicant:
Hitachi Kokusai Electric Inc., Tokyo, JP;
Inventors:
Katsuyoshi Hamano, Toyama, JP;
Atsushi Umekawa, Toyama, JP;
Takuya Joda, Toyama, JP;
Akinori Ishii, Toyama, JP;
Masahisa Okuno, Toyama, JP;
Assignee:
Hitachi Kokusai Electric, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); H01L 21/268 (2013.01); H01L 21/67126 (2013.01); H01L 21/68735 (2013.01);
Abstract
Heating within a plane of a substrate may be uniform while a thermal budget is decreased. A substrate processing apparatus includes a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon; an electromagnetic wave supply unit configured to supply an electromagnetic wave to the substrate placed on the substrate mounting unit; and a choke groove formed on a side surface of the substrate mounting unit.