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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9644118 B1

PDFFull Text
Date of Patent:
May. 09, 2017

Filed:

Mar. 03, 2015

Method of releasably attaching a semiconductor substrate to a carrier

Applicants:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Dow Global Technologies Llc, Midland, MA (US);

Inventors:

Mark S. Oliver, Charlestown, MA (US);

Zhifeng Bai, Midland, MI (US);

Michael K. Gallagher, Hopkinton, MA (US);

Assignees:

Dow Global Technologies LLC, Midland, MI (US);

Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);

Attorney:

S. Matthew Cairns

Primary Examiner:

Kimberly Rizkallah

Assistant Examiner:

Dilinh Nguyen

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); C09J 11/06 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); C09J 4/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); C09J 4/00 (2013.01); H01L 21/6835 (2013.01); H01L 24/10 (2013.01); H01L 24/14 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13647 (2013.01);
Abstract

Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.

Find Patent Forward Citations

Oliver, Mark. (2017). Method of releasably attaching a semiconductor substrate to a carrier (U.S. Patent No. 9644118). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9644118

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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