Membrane sheet with bumps for probe card, probe card and method for manufacturing membrane sheet with bumps for probe card

Abstract

A probe card is for testing a wafer which allows for stable contact with electrode pads of a wafer simultaneously under small contact pressure in wafer test procedures. A probe card includes a frame plate which is provided with a plurality of through-holes corresponding to semiconductor chips of a wafer, a wiring substrate, an anisotropic conductive membrane which has a size corresponding to that of the through-hole and is fixed in the through-hole or on a periphery of the through-hole in the frame plate, and a contact membrane which also has a size corresponding to that of the through-hole and is fixed on the periphery of the through-hole in the frame plate. The contact membrane includes an insulating membrane, a conductive electrode provided in the insulating membrane and on a reverse face of the insulating membrane, and a bump. The bump is formed by plating an upper end of an electrode body which is exposed by half-etching the insulating membrane. The bump has a pointy tip end portion is electrically contacted with a terminal in the wiring substrate via a conductive path in the anisotropic conductive membrane.