The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Jul. 13, 2015
Applicant:

Rf Micro Devices, Inc., Greensboro, NC (US);

Inventor:

Andrew P. Ritenour, Colfax, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/34 (2006.01); H01L 29/20 (2006.01); H01L 21/283 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 29/778 (2006.01); H01L 23/367 (2006.01); H01L 23/482 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); H01L 21/0254 (2013.01); H01L 21/02378 (2013.01); H01L 21/283 (2013.01); H01L 21/76898 (2013.01); H01L 23/34 (2013.01); H01L 23/3677 (2013.01); H01L 23/4824 (2013.01); H01L 29/2003 (2013.01); H01L 29/66431 (2013.01); H01L 29/7786 (2013.01); H01L 29/0657 (2013.01); H01L 29/0696 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device having improved heat dissipation is disclosed. The semiconductor device includes a semi-insulating substrate and epitaxial layers disposed on the semi-insulating substrate wherein the epitaxial layers include a plurality of heat conductive vias that are disposed through the epitaxial layers with the plurality of heat conductive vias being spaced along a plurality of finger axes that are aligned generally parallel across a surface of the epitaxial layers. The semiconductor device further includes an electrode having a plurality of electrically conductive fingers that are disposed along the plurality of finger axes such that the electrically conductive fingers are in contact with the first plurality of heat conductive vias.


Find Patent Forward Citations

Ritenour, Andrew. (2017). Semiconductor device having improved heat dissipation (U.S. Patent No. 9640632). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9640632

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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