The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Oct. 19, 2012
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Joachim Weyers, Hoehenkirchen-Siegertsbrunn, DE;

Kevni Bueyuektas, Munich, DE;

Franz Hirler, Isen, DE;

Anton Mauder, Kolbermoor, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 25/00 (2006.01); H01L 23/64 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 17/0033 (2013.01); H01L 23/645 (2013.01); H01L 25/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes a first coil that is monolithically integrated in a first portion of a semiconductor body and that includes a first winding wrapping around a first core structure. A second coil is monolithically integrated in a second portion of the semiconductor body and includes a second winding wrapping around the second core structure. The first and second coils are magnetically coupled with each other. An insulator frame in the semiconductor body surrounds the first portion and excludes the second portion. High dielectric strength between the first and the second coils is achieved without patterning a backside metallization for connecting the turns of the windings and without being restricted to thin substrates.


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