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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9640423 B1

PDFFull Text
Expired
Date of Patent:
May. 02, 2017

Filed:

Jul. 30, 2015

Integrated circuits and methods for their fabrication

Applicant:

Globalfoundries, Inc., Grand Cayman, KY;

Inventors:

Bharat Krishnan, Mechanicville, NY (US);

Shishir Ray, Clifton Park, NY (US);

Jinping Liu, Ballston Lake, NY (US);

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:

Lorenz & Kopf, LLP

Primary Examiner:

Brett Feeney

Assistant Examiner:

Erik T Peterson

Int. Cl.
CPC ...
H01L 21/763 (2006.01); H01L 21/764 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/762 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/763 (2013.01); H01L 21/02345 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/02675 (2013.01); H01L 21/764 (2013.01); H01L 29/0649 (2013.01); H01L 29/66545 (2013.01); H01L 29/7851 (2013.01); H01L 21/02164 (2013.01); H01L 21/76224 (2013.01); H01L 21/76882 (2013.01); H01L 21/76883 (2013.01);
Abstract

Integrated circuits and methods for producing the same are provided. In accordance with one embodiment a method of producing an integrated circuit includes forming a trench defined by a first material. The trench is filled with a second material to produce a gap defined within the second material, where the second material is in a solid state. The second material is reflowed within the trench to reduce a volume of the gap, and the second material is then solidified within the trench.

Find Patent Forward Citations

Krishnan, Bharat. (2017). Integrated circuits and methods for their fabrication (U.S. Patent No. 9640423). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9640423

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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