The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Sep. 15, 2015
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Hirofumi Masuhara, Kyoto, JP;

Kenichiro Arai, Kyoto, JP;

Masahiro Miyagi, Kyoto, JP;

Toru Endo, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02019 (2013.01); H01L 21/02282 (2013.01); H01L 21/30608 (2013.01); H01L 21/6708 (2013.01); H01L 21/6715 (2013.01); H01L 21/67115 (2013.01);
Abstract

In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate.


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