The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Aug. 30, 2013
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Hiroshi Yamada, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/073 (2006.01); G01R 1/04 (2006.01); H01L 21/687 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2887 (2013.01); G01R 1/0408 (2013.01); G01R 1/07364 (2013.01); G01R 31/2893 (2013.01); H01L 21/68 (2013.01); H01L 21/687 (2013.01);
Abstract

Disclosed is a method for mounting a wafer on a probe card. In the wafer mounting method, an extendable tubular member is placed to surround the probe card, the wafer is placed on a chuck top, the chuck top is supported by a movable stage, and the stage is moved toward the probe card together with the wafer and the chuck top to bring the chuck top into contact with the tubular member. After the chuck top is in contact with the tubular member, the stage is moved toward the probe card together with the wafer and the chuck top to bring the wafer into contact with the probe card and maintain a positional relationship of the stage, the wafer, and the chuck top. After the wafer is in contact with the probe card, a space surrounded by the chuck top, the tubular member, and the probe card is evacuated.


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