The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Feb. 03, 2014
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 61/04 (2006.01); C08G 73/22 (2006.01); C08J 5/24 (2006.01); H01L 23/29 (2006.01); H01L 23/14 (2006.01); C08G 73/02 (2006.01); C08K 5/378 (2006.01); C08L 79/04 (2006.01); H05K 1/03 (2006.01); B32B 15/14 (2006.01); C08L 63/00 (2006.01); C08G 14/06 (2006.01); C08L 61/34 (2006.01); B32B 15/08 (2006.01); B32B 15/092 (2006.01); B32B 27/04 (2006.01);
U.S. Cl.
CPC ...
C08G 73/22 (2013.01); B32B 15/14 (2013.01); C08G 14/06 (2013.01); C08G 73/0233 (2013.01); C08J 5/24 (2013.01); C08K 5/378 (2013.01); C08L 61/04 (2013.01); C08L 61/34 (2013.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); H01L 23/145 (2013.01); H01L 23/295 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2305/076 (2013.01); B32B 2307/206 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); B32B 2581/00 (2013.01); C08J 2379/04 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0366 (2013.01);
Abstract
A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.