The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Feb. 12, 2014
Applied Materials, Inc., Santa Clara, CA (US);
Kun Xu, Sunol, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Doyle E. Bennett, Santa Clara, CA (US);
Shih-Haur Shen, Sunnyvale, CA (US);
Hassan G Iravani, San Jose, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Tzu-Yu Liu, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick(t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t; receiving a measured temperature, T(t), associated with the conductive layer at the time t; calculating resistivity ρof the conductive layer at the measured temperature T(t); adjusting the measurement of the thickness using the calculated resistivity ρto generate an adjusted measured thickness; and detecting a polishing endpoint or an adjustment for a polishing parameter based on the adjusted measured thickness.