The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Apr. 27, 2015
Applicant:

Laird Technologies, Inc., Earth City, MO (US);

Inventors:

Gerald R. English, Glen Ellyn, IL (US);

Joseph C. Boetto, Hoffman Estates, IL (US);

Philip van Haaster, Corona, CA (US);

Assignee:

Laird Technologies, Inc., Earth City, unknown;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 13/04 (2006.01); B23P 17/00 (2006.01); H01C 17/00 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0024 (2013.01); H05K 9/003 (2013.01); H05K 9/0026 (2013.01); H05K 9/0073 (2013.01);
Abstract

According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.


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