The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Feb. 17, 2016
Fuji Xerox Co., Ltd., Tokyo, JP;
Saori Nishizaki, Kanagawa, JP;
Tomoki Umezawa, Kanagawa, JP;
Hirokazu Matsuzaki, Kanagawa, JP;
Takeshi Minamiru, Kanagawa, JP;
Tatsumi Inomoto, Kanagawa, JP;
Eitoku Sonoda, Kanagawa, JP;
Kenji Yamazaki, Kanagawa, JP;
FUJI XEROX CO., LTD., Tokyo, JP;
Abstract
Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.