logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9630927 B1

PDFFull Text
Expired
Date of Patent:
Apr. 25, 2017

Filed:

Jan. 17, 2014

Method and manufacturing system

Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Wei-Pin Huang, Miaoli County, TW;

Wen-Chi Chien, Miaoli County, TW;

Bing-Yuan Cheng, Hsinchu County, TW;

Feng-Ning Lee, Taoyuan County, TW;

Wei-Cheng Wang, Taoyuan County, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Attorney:

Jones Day

Primary Examiner:

Thuy Dao

Int. Cl.
CPC ...
G01N 21/88 (2006.01); G01N 21/63 (2006.01); G01N 21/21 (2006.01); G01N 21/47 (2006.01); C07D 237/32 (2006.01); G05B 19/418 (2006.01); C07D 401/10 (2006.01); C07D 401/12 (2006.01); C07D 403/10 (2006.01); C07D 403/12 (2006.01); C07D 405/12 (2006.01); C07D 413/12 (2006.01); C07D 417/12 (2006.01); C07D 417/14 (2006.01); C07D 513/04 (2006.01);
U.S. Cl.
CPC ...
C07D 237/32 (2013.01); C07D 401/10 (2013.01); C07D 401/12 (2013.01); C07D 403/10 (2013.01); C07D 403/12 (2013.01); C07D 405/12 (2013.01); C07D 413/12 (2013.01); C07D 417/12 (2013.01); C07D 417/14 (2013.01); C07D 513/04 (2013.01); G05B 19/418 (2013.01); G05B 19/4189 (2013.01); G05B 2219/31033 (2013.01); G05B 2219/32278 (2013.01); Y02P 90/04 (2015.11); Y02P 90/28 (2015.11);
Abstract

A method is provided. The method includes: assigning a buffer to a first wafer lot comprising a plurality of wafers according to a first trigger event associated with an equipment; and assigning a transporter to a second wafer lot comprising a plurality of wafers according to a second trigger event associated with the equipment.

Find Patent Forward Citations

Huang, Wei-Pin. (2017). Method and manufacturing system (U.S. Patent No. 9630927). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9630927

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…