The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Feb. 19, 2016
Applicant:

Sumco Corporation, Tokyo, JP;

Inventor:

Tomonori Kawasaki, Tokyo, JP;

Assignee:

SUMCO Corporation, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 37/10 (2012.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 7/228 (2013.01); B24B 37/107 (2013.01);
Abstract

Apparatus polishing one side of a wafer to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth is provided. In the apparatus of the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer. The contact angle of the polishing cloth (S) is measured; the rotation speed of the head and the surface plate is determined based on the measured contact angle of the polishing cloth (S). One side of the wafer is polished by rotating the head and the surface plate at the determined rotation speed (S, S).


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Kawasaki, Tomonori. (2017). Single side polishing apparatus for wafer (U.S. Patent No. 9630292). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9630292

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