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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9630289 B1

PDFFull Text
Date of Patent:
Apr. 25, 2017

Filed:

Sep. 23, 2013

Polishing method involving a polishing member polishing at angle tangent to the substrate rotational direction

Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Tetsuji Togawa, Tokyo, JP;

Atsushi Yoshida, Tokyo, JP;

Michiyoshi Yamashita, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:

Baker & Hostetler LLP

Primary Examiner:

Joseph J Hail

Assistant Examiner:

Arman Milanian

Int. Cl.
CPC ...
B24B 9/06 (2006.01); B24B 21/00 (2006.01); B24B 21/20 (2006.01); B24B 9/10 (2006.01);
U.S. Cl.
CPC ...
B24B 9/065 (2013.01); B24B 21/002 (2013.01); B24B 9/102 (2013.01); B24B 21/00 (2013.01); B24B 21/20 (2013.01);
Abstract

A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.

Find Patent Forward Citations

Togawa, Tetsuji. (2017). Polishing method involving a polishing member polishing at angle tangent to the substrate rotational direction (U.S. Patent No. 9630289). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9630289

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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