The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Apr. 26, 2016
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;

Inventors:

Kazuhiro Kobayashi, Nagano, JP;

Junji Sato, Nagano, JP;

Yasuhiko Kusama, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 24/46 (2013.01); H01L 25/0652 (2013.01); H01L 2224/48091 (2013.01); H01L 2225/0652 (2013.01); H01L 2924/00014 (2013.01);
Abstract

A wiring substrate includes a first wiring substrate, a first insulation layer stacked on the first wiring layer, and second and third insulation layers sequentially stacked on the first insulation layer. An electronic component is mounted on the first insulation layer in a cavity extending through the second and third insulation layers. The cavity is filled with a fourth insulation layer that entirely covers an upper surface of the third insulation layer and covers the electronic component. A second wiring layer is incorporated in the second and third insulation layers and electrically connected to the first wiring layer. The second wiring layer is electrically connected to a third wiring layer, which is stacked on the fourth insulation layer, by a first via wiring extending through the second and third insulation layers.


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